Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the...

3.3% flux by volume
66 core size
Alloy: Sn96.5Ag3.0Cu0.5
Diameter: .025

3.3% flux by volume
66 core size
Alloy: Sn96.5Ag3.0Cu0.5
Diameter: .031

3.3% flux by volume
66 core size
Alloy: Sn96.5Ag3.0Cu0.5
Diameter: .062
Mfr. Part No. SN96.5AG3.0CU0.5-.062-33

Kester EM808 provides hours of stable stencil life, tack time and repeatable print definition. EM808's robust printing characteristics result in consistent solder paste volume regardless of idle time and print speed.

Designed to exceed cutomers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with lead-free alloys such as the family of SnAgCu(SAC).

Developed to reduce bottomside micro-solder ballign and bridgingo n glossy laminates and between connector pins. Designed as a spray flux, 979's activation system provides excellent wetting producing complete and consitent hole-fill.

Designed for maximum robustness in reflow profiling and printing. Contains the widest possible reflow processing window.

Designed as an all-purpose water-soluble paste, Hydro Mark 531 provides consistent hours of stable stencil life, tack time, and printing characteristics.

A general application watersoluble paste that demonstrates exceptional characteristics in all weather environments and reduced voiding in BGa attach operations.

Provides optimal performance in all types of dispensing applications.

Leaves printed circuit boards exhibiting a high surface insulation resistance (1011*).

Passes insulation resistance requirement for Class 3 products, QPL approved for MIL-F-14256-F Type LR-L, conforms to IPC-SF-818 Type L3CN, and Bellcore TR-TSY-000078 specifications.

Designed for foam applications. VOC-Free, no clean flux that is water based, water soluble, halide free, non-flammable and eliminate the need for a flux thinner.

For automated wave or drag soldering processes. Residue can be removed completely without neutralizers in water. Complies with IPC-SF-818 Type H3C. Has improved stability in low temperature storage without performance loss. Reduced foaming in water...

Original neutral pH fluxes designed for automated wave or drag soldering processes. Residue left after soldering can be removed completely without neutralizers in water. Complies with IPC-SF-818 Type H3C.