Product
Characteristics |
Designed for maximum robustness in reflow profiling and
printing. Contains the widest possible reflow processing window. Capable
of printing downtimes of up to 90 minutes with an effective first print
down to 20 mils. Maintains its activity and printing characteristics for
up 8 hours without any shear thinning. Compatible with enclosed print
head systems.
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Full residue, standard no-clean paste for all reflow applications.
R244 has been an industry standard formula that combines many good properties
into a user friendly product
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Designed as an all-purpose water-soluble paste, Hydro
Mark 531 provides consistent hours of stable stencil life, tack time,
and printing characteristics. Offers improved anti-slump characteristics
along with excellent solderability to a wide range of surface and component
lead metallizations, solving problems caused by slumping, bridging, and
wetting.
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A general application water-soluble paste that demonstrates
exceptional characteristics in all weather environments and reduced voiding
in BGA attach operations. R562 maintains its print characteristics, tack,
and activity even after prolonged exposure to environmental extremes.
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Designed to reduce voiding in BGA solder connections and
print over a range of environmental conditions. R560 features extremely
stable stencil and tack life, while exhibiting excellent wetting to a
variety of metalizations. Compatible with enclosed print head systems.
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Residue
Removal |
Not normally required.
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Not normally required.
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Use de-ionized or soft tapwater at
120-140°F.
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Use de-ionized or soft tapwater at 120-140°F.
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Use de-ionized or soft tapwater at 120-140°F.
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Compliant
Specifications |
Telcordia Issue 1GR-78-ORE, IPC / J-STD-004
Classification ROL0
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Telcordia Issue 1GR-78-ORE, IPC / J-STD-004
Classification ROL0
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IPC / J-STD-004
Classification ORM0
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IPC / J-STD-004
Classification ORH0
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IPC / J-STD-004
Classification ORH0
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