Kester Products for Lead-Free Soldering
Kester understands the challenges associated with the transition from leaded to lead-free soldering. With Kester Lead-Free Solutions, process engineers have access to a complete line of lead-free products and chemistries backed by Kester's unsurpassed experience in soldering technology.
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Common Lead-Free Alloys
|
| Alloys |
Melt Temperature
|
Application |
| Sn96.5Ag3.0Cu0.5 |
423°F/217°C
|
SMT/Hand Soldering |
| Sn99.3Cu0.7 |
440°F/227°C
|
Wave |
In response to demand for a low cost/low copper dissolution alloy, Kester developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize...
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the...
2.2% flux by volume
58 core size
Alloy: Sn96.5Ag3.0Cu0.5
Diameter: .025
3.3% flux by volume
66 core size
Alloy: Sn96.5Ag3.0Cu0.5
Diameter: .025
2.2% flux by volume
58 core size
Alloy: Sn96.5Ag3.0Cu0.5
Diameter: .031
3.3% flux by volume
66 core size
Alloy: Sn96.5Ag3.0Cu0.5
Diameter: .031
2.2% flux by volume
58 core size
Alloy: Sn96.5Ag3.0Cu0.5
Diameter: .062
3.3% flux by volume
66 core size
Alloy: Sn96.5Ag3.0Cu0.5
Diameter: .062
Mfr. Part No. SN96.5AG3.0CU0.5-.062-33
The key variables in lead-free SMT are higher reflow temperatures, flux activity, residue characteristics, cleanability, and pin testability. The slower wetting speeds associated with lead-free alloys require enhanced flux systems. Kester solder pastes...
Kester EM808 provides hours of stable stencil life, tack time and repeatable print definition. EM808's robust printing characteristics result in consistent solder paste volume regardless of idle time and print speed.
EnviroMark 808 Lead-Free Water-Soluble Solder Paste, Stencil Printing, Sn96.5Ag03Cu0.5 325, 600g Cartridge. The key variables in lead-free SMT are higher reflow temperatures, flux activity, residue characteristics, cleanability, and pin testability.
Designed to exceed cutomers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with lead-free alloys such as the family of SnAgCu(SAC).
Designed to exceed cutomers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with lead-free alloys such as the family of SnAgCu(SAC).
Developed to reduce bottomside micro-solder ballign and bridgingo n glossy laminates and between connector pins. Designed as a spray flux, 979's activation system provides excellent wetting producing complete and consitent hole-fill.
Developed to reduce bottomside micro-solder ballign and bridgingo n glossy laminates and between connector pins. Designed as a spray flux, 979's activation system provides excellent wetting producing complete and consitent hole-fill.
Kester 2220-VF is a high activity, organic flux designed for lead-free automated wave solder applications. The flux will provide maximum capillary wetting action up plated through-holes, making it ideal for use on multilayer boards. Along with this...
Lead-free, halogen-free solder paste with state-of-the-art capabilities to support modern electronics assembly challenges. Capable of printing and reflowing 01005 components, even in air reflow, with minimal graping behavior.
Lead-free, halogen-free solder paste with state-of-the-art capabilities to support modern electronics assembly challenges. Capable of printing and reflowing 01005 components, even in air reflow, with minimal graping behavior.
K100LD Lead-Free Solder Wire has the Lowest Rate of Copper Dissolution. K100LD is a lead-free solder alloy that can be used in wave soldering, selective soldering systems and dip tinning operations. K100LD has the Lowest Dissolution of Copper amongst...