Kester 970 Series Water Based VOC-Free No-Clean Soldering Fluxes

Clearance Item!


Designed for foam applications. VOC-Free, no clean flux that is water based, water soluble, halide free, non-flammable and eliminate the need for a flux thinner.


Developed to reduce bottomside micro-solder balling and bridging. The wetting system is designed to allow for a lager process window and can survive the longer dwell times in extremely turbulent chip waves. Designed for spary applications.